HEAD Waterjet Semiconductor Wafer Cutting Solution

Customer Case Study – HEAD Waterjet Semiconductor Wafer Cutting Solution

Company Name

A Renowned MEMS Manufacturing Research Institute

Waterjet Model

HD3D20AS-0303BA-3A

Customer Background

The customer is a leading MEMS manufacturing research institute specializing in wafer semiconductor cutting research and testing. They required a solution providing high-precision cutting and excellent electrical performance to support subsequent material processing and performance analysis.

Customer Requirements

1. Workpiece Cutting
   Cutting precision of ±0.05mm to meet the high standards of scientific research.

2. Comprehensive Safety Protection
   Ensure operator safety and prevent any accidents during the cutting process.

3. Customized Fixtures
   Precisely customized fixtures to ensure stable support and cutting accuracy.

4. Tailored Design
   Unique machine bed design tailored to material size and experimental space.

Solution Design

HEAD Technology delivered a customized HEAD0303BA fully enclosed waterjet cutting machine, featuring the following:

1. Overall Design

• Fully enclosed structure: Ensures doors remain closed during operation, with an intelligent system automatically shutting down the machine to mitigate risks and reduce noise.

2. High-Precision Cutting

• ±0.05mm precision: Ensures wafer electrical performance and stability during subsequent processes.

3. Customized Fixtures

• Designed specialized fixtures for laboratory testing needs, ensuring material stability and support.

4. Tailored Machine Bed

• Designed a unique machine bed to fit the dimensions of experimental materials.

5. 4th Generation Aerospace Cast Beam

• T6-treated aluminum alloy: High strength, deformation resistance, reduced weight, and improved motion speed.

  
  

Equipment Advantages

1. Safety Assurance
   Comprehensive safety design, ideal for laboratories and institutions with high safety requirements.

2. Efficient Cutting
   Combines high-pressure waterjet technology to enhance efficiency and minimize material waste.

3. Tailored Solutions
   Provides tailored fixtures and bed designs to accommodate diverse requirements.

4. Noise Reduction
   Fully enclosed structure effectively reduces noise, optimizing the working environment.

Customer Feedback

Upon delivery, the customer expressed high satisfaction with the machine’s performance, safety, and efficient customization. They noted that it not only met their current research needs but also provided reliable support for future projects.

Conclusion

The HEAD waterjet tailored wafer semiconductor cutting solution significantly improved the customer's wafer processing efficiency and quality, providing robust support for semiconductor material research.